Advanced Interconnect Solutions
Global Manufacturing Solutions, Local Support
Companies Represented by AIS

 

Bare Board Group is the BEST solution for LOW to MID VOLUME printed circuit board manufacturing.  BBG offers all products, even expedited, FOB your dock.  With domestic quoting, technical service, and support coupled with US-educated management overseas, BBG makes it worry-free and cost effective to procure high quality PCBs from Asia.  Standard 3-4 weeks production, DELIVERED.  Delivery is FREE with BBG!  BBG also offers prototypes in as little as 5 days, ultra-low minimums for re-orders, and RoHS compliant products.  Let us help you enjoy the cost savings of Asia without the need for high volume and eliminate logistical and communication barriers.  High layer counts and difficult requirements welcomed.   24-hour availabiltiy, pay as you pull inventory programs, let BBG simplify your PCB purchasing....contact Advanced Interconnect Solutions today!



Eltek is focused on manufacturing high quality and challenging rigid flex circuits.  Eltek boards are used in military, aerospace, and medical applications, where there's no option for failure.  Eltek is certified to Mil-PRF-31032, Mil-P-50884D, Mil-P-55110G, ISO 9001 2000, ISO 14001:2004, OSHSA 18001, and AS9100.  .  Ask to see some samples of Eltek's work and how they've given package designers the innovation, circuit density, reliability, focus, certification, and friendly service needed to compete in today's electronics marketplace.  Laser drilling, 75 micron lines, tight impedance requirements?  Via in pad?  Silver epoxy shielding?  Liquid Crystal Polymer, Teflon, ceramic-Teflon hyrbrids, Stablcor? No problem!  Eltek also work on technically challenging rigid boars.  Contact us today to get started.

 

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With over 35 years of RF design and manufacturing experience, Putnam RF is the BEST solution for your RF requirements.  Putnam has the ability to support .5mm pitch BGA's, .003" line/space, 15:1 aspect ration, 5% impedance, up to 30+ layers (including backplanes), microvias, cavity boards, and supports heatsink bonding and RF shielding. Putnam has full service machining capabilities, cable and harness assembly, and complete RF and mechanical assemblies.  Current designs include 3MHz to 6GhZ, 0.1 to 3200 Watts, limped element, stripline, and suspended substrate, with engineering capabilities including synthesis software, 3-D analysis, and thermal analysis.  Testing capabilities include Agilent ENA, high power testing 2MHz to 3GHz, and infrared imaging.  Contact Advanced Interconnect Solutions today for your complete RF solution with Putnam RF!

Advanced Interconnect Solutions - Global Manufacturing Solutions, Local Support
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